AMAOE OV 4 BGA Reballing Stencils for OPPO – Precision Solder Paste Application

AMAOE OV 4 BGA Reballing Stencils for OPPO – Precision Solder Paste Application

Upgrade your PCB repair and rework process with the AMAOE OV 4 BGA Reballing Stencil, designed specifically for OPPO devices. These high-quality stencils ensure precise solder paste application, making them essential for BGA reballing, SMD soldering, and PCB repairs.

Why Choose Our BGA Reballing Stencils?

Enhanced Accuracy – Eliminates guesswork in solder paste application for flawless PCB repairs.
Long-Lasting Performance – Made from premium stainless steel for durability and repeated use.
Time-Saving Solution – Streamlines reballing and soldering tasks for faster, more efficient repairs.
Whether you’re a professional technician or a DIY repair enthusiast, the AMAOE OV 4 BGA Reballing Stencils provide the precision and reliability needed for flawless OPPO/VIVO PCB repairs.

Key Features:

Precision Reballing & Soldering – Perfectly aligns with BGA (Ball Grid Array) chips for accurate solder ball placement during reballing.
Compatible with OPPO/VIVO Models – Tailored for specific OPPO/VIVO devices, ensuring a perfect fit for solder pads.
Laser-Cut Apertures – High-accuracy openings for controlled solder paste deposition, reducing bridging and defects.
Durable Stainless Steel Construction – Built to withstand repeated use and high-temperature soldering processes.
Efficient SMD Assembly – Ideal for surface-mount component (SMD) soldering, ensuring strong, reliable connections.
Thinness: 0.12MM

Model Numbers Supported;

77920-21
56020
7210M-11
PMI632
SDR660
PM670A
PM6125
BGA254
PM670
PM7150
PM6150L
SM6125
SM6150
SM7150
SDM710
OPPO : A11/A11X/A52/K3/K5/RENO/RENO2/R17Pro

VIVO-NEX/S1Pro/U3X/U10/X27/X27Pro/Y50/Y9S/Z5X