AMAOE SAM-18 CPU BGA REWORK REBALLING STENCIL 0.12MM

Precision Stencil for Samsung Exynos Circuitry Repairs:

Features:

Model-Specific Design: Tailored specifically for the Sam-18 For Samsung series , ensuring a perfect fit for precise repair work.
High-Precision Cutouts: Detailed outlines for accurate application of soldering paste or for guiding component placement.
Ultra-Thin Construction: Only 0.12MM thickness for superior flexibility and ease of use on intricate circuit boards.
Durable Material: Crafted from high-grade, heat-resistant material to withstand the rigors of repeated use in high-temperature rework and soldering processes.
Alignment Markings: Clear indicators for proper orientation and placement, ensuring flawless operation during micro-soldering tasks.
Uniform Hole Distribution: Strategically placed holes to provide even distribution of soldering paste and minimize waste.
Versatile Application: Suitable for various rework scenarios, including soldering, component replacement, and bridge prevention.
Easy to Clean and Maintain: The stencil can be easily cleaned with standard solvent to ensure long-term usability.
Protective Packaging: Comes with appropriate packaging to protect against bending and damage during storage or transport.

Model supported :

58083-11
7709B
SPU15/Q
SN3U6P23
SK8K7320
SPU16
180085
S620
SPA05
E8835P
BGA254
E8535P
QPA4580
110228
SM5714
S6566
38P2C
8267
78078
QDM3525

This professional-grade stencil is an essential tool for technicians specializing in mobile phone repairs, offering reliability and precision in one package.