MECHANIC UV 559 SOLDERING FLUX PASTE for Mobile Repairing

MECHANIC UV 559 SOLDERING FLUX PASTE for Mobile Repairing

• Flux Type: UV-559
• Volume: 10ml/10cc
• Dimension: 93 x 33 x 23mm
• Material: the mixture of high-quality alloyed powder and resinic pasty flux, it can avoid the pale yellow residue.
• Color: off white

• Insulated: Yes
• Application: for soldering and reballing of computer and phone chips.
• Advantage: Good immersion and high intensity joint.
• Function: for BGA , PGA reworkin.
• 100%: New Type, high quality.